Analytic Simulations of Packaging Cardboards with Non-Rigid Adhesives
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: International Journal on Recent and Innovation Trends in Computing and Communication
سال: 2019
ISSN: 2321-8169
DOI: 10.17762/ijritcc.v7i6.5311